Heat Sinks

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
ATS-CPX025025010-137-C2-R0 HEATSINK 25X25X10MM L-TAB CP Advanced Thermal Solutions Inc.	4 847 In Stock	1 : 2,60000 € Bulk	pushPIN™	Bulk	Active	Top Mount, Extrusion	Assorted (BGA, LGA, CPU, ASIC...)	Push Pin	Square, Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.394" (10.00mm)	-	18.36°C/W @ 100 LFM	-	Aluminum	Blue Anodized
ATS-CPX025025015-138-C2-R0 HEATSINK 25X25X15MM L-TAB CP Advanced Thermal Solutions Inc.	2 875 In Stock	1 : 3,31000 € Bulk	pushPIN™	Bulk	Active	Top Mount, Extrusion	Assorted (BGA, LGA, CPU, ASIC...)	Push Pin	Square, Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.590" (15.00mm)	-	12.18°C/W @ 100 LFM	-	Aluminum	Blue Anodized
ATS-CPX040040010-113-C2-R0 HEATSINK 40X40X10MM XCUT CP Advanced Thermal Solutions Inc.	1 346 In Stock	1 : 3,49000 € Bulk	pushPIN™	Bulk	Active	Top Mount, Extrusion	Assorted (BGA, LGA, CPU, ASIC...)	Push Pin	Square, Fins	1.575" (40.00mm)	1.575" (40.00mm)	-	0.394" (10.00mm)	-	11.79°C/W @ 100 LFM	-	Aluminum	Blue Anodized
ATS-CPX070070025-136-C1-R0 HEATSINK 70X70X25MM XCUT CP Advanced Thermal Solutions Inc.	1 274 In Stock	1 : 8,07000 € Tray	pushPIN™	Tray	Active	Top Mount, Extrusion	Assorted (BGA, LGA, CPU, ASIC...)	Push Pin	Square, Fins	2.756" (70.00mm)	2.756" (70.00mm)	-	0.984" (25.00mm)	-	2.17°C/W @ 100 LFM	-	Aluminum	Blue Anodized
ATS-CPX070070025-136-C2-R0 HEATSINK 70X70X25MM XCUT CP Advanced Thermal Solutions Inc.	3 219 In Stock	1 : 10,61000 € Bulk	pushPIN™	Bulk	Active	Top Mount, Extrusion	Assorted (BGA, LGA, CPU, ASIC...)	Push Pin	Square, Fins	2.756" (70.00mm)	2.756" (70.00mm)	-	0.984" (25.00mm)	-	2.18°C/W @ 100 LFM	-	Aluminum	Blue Anodized
567-24AB 1/8 BRICK HEATSINK 55X20.7X6.1MM Wakefield Thermal Solutions	394 In Stock	1 : 3,17000 € Tray	567	Tray	Active	Top Mount	Eighth Brick DC/DC Converter	Bolt On, Thermal Material	Rectangular, Fins	2.165" (55.00mm)	0.815" (20.70mm)	-	0.240" (6.10mm)	-	7.20°C/W @ 300 LFM	7.20°C/W	-	Unfinished
ATS-FPX060060015-23-C1-R0 HEATSINK 60X60X15MM XCUT FP Advanced Thermal Solutions Inc.	4 407 In Stock	1 : 4,86000 € Tray	pushPIN™	Tray	Active	Top Mount, Extrusion	Assorted (BGA, LGA, CPU, ASIC...)	Push Pin	Square, Fins	2.362" (60.00mm)	2.362" (60.00mm)	-	0.590" (15.00mm)	-	11.99°C/W @ 100 LFM	-	Aluminum	Blue Anodized
ATS-CPX060060025-132-C1-R0 HEATSINK 60X60X25MM XCUT CP Advanced Thermal Solutions Inc.	452 In Stock	1 : 5,24000 € Tray	pushPIN™	Tray	Active	Top Mount, Extrusion	Assorted (BGA, LGA, CPU, ASIC...)	Push Pin	Square, Fins	2.362" (60.00mm)	2.362" (60.00mm)	-	0.984" (25.00mm)	-	2.65°C/W @ 100 LFM	-	Aluminum	Blue Anodized
SKV606021-AL ALUMINUM HEATSINK 60X60X21MM Wakefield Thermal Solutions	472 In Stock	1 : 9,38000 € Bulk	SKV	Bulk	Active	Top Mount, Skived	-	Push Pin	Square, Fins	2.362" (60.00mm)	2.362" (60.00mm)	-	0.827" (21.00mm)	-	0.90°C/W @ 200 LFM	7.90°C/W	Aluminum	-
HSB28-606022 HEAT SINK, BGA, 60 X 60 X 22 MM, Same Sky (Formerly CUI Devices)	239 In Stock	1 : 6,43000 € Box	HSB	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	2.362" (60.00mm)	2.362" (60.00mm)	-	0.866" (22.00mm)	15.83W @ 75°C	1.40°C/W @ 200 LFM	4.74°C/W	Aluminum Alloy	Black Anodized

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Heat sinks are thermal management components designed to dissipate heat from high-power electronic devices and prevent overheating. Their core function is based on the principles of conduction, and convection, transferring heat from a heat source—such as a CPU, power transistor, or BGA package—to the surrounding air or a coolant. By increasing the surface area in contact with cooling media, heat sinks help maintain safe temperature levels and protect component reliability and performance.

Most heat sinks are made of aluminum or copper, materials known for their high thermal conductivity. Aluminum heat sinks are lightweight and cost-effective, ideal for general-purpose cooling solutions, while copper heat sinks offer better conductivity for high-performance or space-constrained applications. Finned and extrusion-style heat sinks use strategically shaped surfaces to maximize exposure to air, enhancing natural or forced convection. Cross-cut designs further improve airflow and thermal dispersion. In advanced applications, heat pipes, liquid cooling, or graphite spreaders may be used to rapidly move heat away from the source. For compact or passive systems, passive heat exchangers rely entirely on natural airflow without the use of fans.

Proper thermal contact between the heat sink and device is critical—thermal interface materials (TIMs) such as thermal paste, pads, or solder are used to fill microscopic gaps and reduce thermal resistance. When selecting a heat sink, consider the thermal output of the component, available space, airflow conditions, and the thermal resistance of the system.