Assmann WSW Components Heat Sinks

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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
V7236B1
V7236B1
HEATSINK TO-220 19.05X13.21MM
Assmann WSW Components
21 636
In Stock
1 : 0,31000 €
Bulk
-
Bulk
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.750" (19.05mm)
0.520" (13.21mm)
-
0.500" (12.70mm)
-
-
24.00°C/W
Aluminum
Black Anodized
V8508A
V8508A
HEATSINK TO-220 19X12.80MM
Assmann WSW Components
15 332
In Stock
1 : 0,37000 €
Bulk
-
Bulk
Active
Board Level
TO-220
Press Fit
Rectangular, Fins
0.748" (19.00mm)
0.504" (12.80mm)
-
0.500" (12.70mm)
3.0W @ 60°C
14.00°C/W @ 200 LFM
-
Aluminum
Black Anodized
16 920
In Stock
1 : 0,41000 €
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.335" (8.50mm)
0.335" (8.50mm)
-
0.315" (8.00mm)
-
-
32.00°C/W
Aluminum Alloy
Black Anodized
V-1100-SMD/B-L
V-1100-SMD/B-L
HEAT SINK COPPER DPAK TO-252
Assmann WSW Components
20 757
In Stock
1 : 0,49000 €
Bulk
-
Bulk
Active
Top Mount
TO-252 (DPak)
SMD Pad
Rectangular, Fins
0.320" (8.13mm)
0.790" (20.07mm)
-
0.390" (9.91mm)
-
-
25.00°C/W
Copper
Tin
V-1100-SMD/A-L
V-1100-SMD/A-L
HEATSINK TO-263 12.70X26.20MM
Assmann WSW Components
6 948
In Stock
1 : 0,50000 €
Bulk
-
Bulk
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.500" (12.70mm)
1.031" (26.20mm)
-
0.390" (9.91mm)
-
-
23.00°C/W
Copper
Tin
V2017B
V2017B
HEATSINK ANOD ALUM CPU
Assmann WSW Components
35 608
In Stock
1 : 0,57000 €
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
-
Square, Pin Fins
0.394" (10.00mm)
0.394" (10.00mm)
-
0.275" (7.00mm)
-
-
31.00°C/W
Aluminum
Black Anodized
5 513
In Stock
1 : 0,59000 €
Tray
-
Tray
Active
Board Level
TO-220
Bolt On and PC Pin
Rectangular, Fins
0.984" (25.00mm)
1.181" (30.00mm)
-
0.472" (12.00mm)
-
-
10.00°C/W
Aluminum
Black Anodized
V-1100-SMD/B
V-1100-SMD/B
HEAT SINK COPPER DPAK TO-252
Assmann WSW Components
98 233
In Stock
1 : 0,67000 €
Cut Tape (CT)
400 : 0,48683 €
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-252 (DPak)
SMD Pad
Rectangular, Fins
0.320" (8.13mm)
0.790" (20.07mm)
-
0.390" (9.91mm)
-
-
25.00°C/W
Copper
Tin
V-1102-SMD/A-L
V-1102-SMD/A-L
HEATSINK TO-263 19.38X25.40MM
Assmann WSW Components
7 534
In Stock
1 : 1,40000 €
Bulk
-
Bulk
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.763" (19.38mm)
1.000" (25.40mm)
-
0.450" (11.43mm)
-
23.00°C/W @ 300 LFM
11.00°C/W
Copper
Tin
18 050
In Stock
1 : 1,66000 €
Bulk
-
Bulk
Active
Top Mount
6-Dip and 8-Dip
Press Fit
Rectangular, Fins
0.334" (8.50mm)
0.250" (6.35mm)
-
0.189" (4.80mm)
-
-
80.00°C/W
Aluminum
Black Anodized
V8508B
V8508B
HEATSINK TO-220 19X12.8MM
Assmann WSW Components
19 905
In Stock
1 : 0,41000 €
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Press Fit and PC Pin
Rectangular, Fins
0.748" (19.00mm)
0.504" (12.80mm)
-
0.500" (12.70mm)
2.0W @ 40°C
8.00°C/W @ 500 LFM
-
Aluminum
Black Anodized
V7237x
V7237C
HEATSINK TO-220 19.05X13.21MM
Assmann WSW Components
1 854
In Stock
1 : 0,42000 €
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
0.750" (19.05mm)
0.520" (13.21mm)
-
0.500" (12.70mm)
-
-
21.00°C/W
Aluminum
Black Anodized
V8508G
V8508G
HEATSINK TO-220 15X12.8MM
Assmann WSW Components
9 620
In Stock
1 : 0,43000 €
Bulk
-
Bulk
Active
Board Level
TO-220
Press Fit
Rectangular, Fins
0.591" (15.00mm)
0.504" (12.80mm)
-
0.500" (12.70mm)
3.0W @ 60°C
14.00°C/W @ 200 LFM
-
Aluminum
Black Anodized
V2008B
V2008B
HEATSINK BLK ALUM TO-220 DUAL
Assmann WSW Components
2 882
In Stock
1 : 0,55000 €
Bulk
-
Bulk
Active
Board Level
TO-220 (Dual)
Bolt On
Rectangular, Fins
1.450" (36.83mm)
1.750" (44.45mm)
-
0.370" (9.40mm)
-
-
7.00°C/W
Aluminum
Black Anodized
V8508H
V8508H
HEAT SINK ANOD ALUM TO-220
Assmann WSW Components
2 206
In Stock
1 : 0,55000 €
Bulk
-
Bulk
Active
Top Mount
TO-220
PC Pin
Square, Pin Fins
0.591" (15.00mm)
0.504" (12.80mm)
-
0.500" (12.70mm)
-
-
26.00°C/W
Aluminum
Black Anodized
2 976
In Stock
1 : 0,61000 €
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.827" (21.00mm)
0.827" (21.00mm)
-
0.236" (6.00mm)
-
-
24.00°C/W
Aluminum Alloy
Black Anodized
2 217
In Stock
1 : 0,64000 €
Bulk
-
Bulk
Active
Top Mount
TO-220
Bolt On and PC Pin
Square, Fins
0.984" (25.00mm)
0.449" (11.40mm)
-
0.260" (6.60mm)
-
-
36.00°C/W
Aluminum
Black Anodized
V5229W
V5229W
HEATSINK ALUM ANOD W/PIN TO-220
Assmann WSW Components
5 895
In Stock
1 : 0,70000 €
Tray
-
Tray
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
0.984" (25.00mm)
1.260" (32.00mm)
-
0.551" (14.00mm)
-
-
12.50°C/W
Aluminum
Black Anodized
3 886
In Stock
1 : 0,70000 €
Tray
-
Tray
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Bolt On and PC Pin
Square, Fins
1.476" (37.50mm)
1.181" (30.00mm)
-
0.472" (12.00mm)
-
-
8.00°C/W
Aluminum
Black Anodized
11 791
In Stock
1 : 0,70000 €
Bulk
-
Bulk
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.984" (25.00mm)
0.472" (12.00mm)
-
0.256" (6.50mm)
-
-
40.00°C/W
Aluminum
Black Anodized
V-1100-SMD/A
V-1100-SMD/A
HEATSINK TO-263 12.70X26.20MM
Assmann WSW Components
4 987
In Stock
1 : 0,73000 €
Cut Tape (CT)
300 : 0,53770 €
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.500" (12.70mm)
1.031" (26.20mm)
-
0.390" (9.91mm)
-
-
23.00°C/W
Copper
Tin
V4330x
V4330N
HEATSINK ANOD ALUM TO-220
Assmann WSW Components
5 989
In Stock
1 : 0,74000 €
Tray
-
Tray
Active
Top Mount
TO-220
Bolt On
Rectangular, Fins
0.787" (20.00mm)
1.142" (29.00mm)
-
0.472" (12.00mm)
-
-
12.00°C/W
Aluminum
Black Anodized
78 147
In Stock
1 : 0,76000 €
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.472" (12.00mm)
0.472" (12.00mm)
-
0.709" (18.00mm)
-
-
27.00°C/W
Aluminum Alloy
Black Anodized
1 946
In Stock
1 : 0,80000 €
Tray
-
Tray
Active
Board Level
TO-220
Bolt On and PC Pin
Rectangular, Fins
1.969" (50.00mm)
1.181" (30.00mm)
-
0.472" (12.00mm)
-
-
7.00°C/W
Aluminum
Black Anodized
V8813X
V8813X
HEATSINK TO-220/TOP-3/SOT-32
Assmann WSW Components
2 500
In Stock
1 : 0,82000 €
Tray
-
Tray
Active
Board Level, Vertical
SOT-32, TO-220, TOP-3
Bolt On and PC Pin
Rectangular, Fins
1.496" (38.00mm)
1.359" (34.50mm)
-
0.492" (12.50mm)
-
-
5.00°C/W
Aluminum
Black Anodized
Showing
of 320

Heat Sinks


Heat sinks are thermal management components designed to dissipate heat from high-power electronic devices and prevent overheating. Their core function is based on the principles of conduction, and convection, transferring heat from a heat source—such as a CPU, power transistor, or BGA package—to the surrounding air or a coolant. By increasing the surface area in contact with cooling media, heat sinks help maintain safe temperature levels and protect component reliability and performance.

Most heat sinks are made of aluminum or copper, materials known for their high thermal conductivity. Aluminum heat sinks are lightweight and cost-effective, ideal for general-purpose cooling solutions, while copper heat sinks offer better conductivity for high-performance or space-constrained applications. Finned and extrusion-style heat sinks use strategically shaped surfaces to maximize exposure to air, enhancing natural or forced convection. Cross-cut designs further improve airflow and thermal dispersion. In advanced applications, heat pipes, liquid cooling, or graphite spreaders may be used to rapidly move heat away from the source. For compact or passive systems, passive heat exchangers rely entirely on natural airflow without the use of fans.

Proper thermal contact between the heat sink and device is critical—thermal interface materials (TIMs) such as thermal paste, pads, or solder are used to fill microscopic gaps and reduce thermal resistance. When selecting a heat sink, consider the thermal output of the component, available space, airflow conditions, and the thermal resistance of the system.