Molex’s Sentrality interconnect system introduces the eye-of-needle (EON) press-fit socket, a mezzanine-style board-to-board and board-to-busbar connector.

Bel Power's quarter-brick DC/DC converters provides up to 60 W of output power with 92% efficiency at a low cost.

Adam Tech's single-wall polyolefin heat shrink tubing is flexible, flame retardant, and has a 2:1 shrink ratio.

Microchip Technology's MCP73837 Li-ion battery charger simplifies design for applications that are powered from either a USB port or an AC adapter.

Adam Tech's SH, CH, MTD, FDP, and FTR series wire-to-board headers and housings come in various pitch, termination, cable type, wire gauge, and mounting types.

Amphenol LTW's M12 highly flexible cable assemblies for constant moving applications are ideal for modern automated manufacturing systems.

Molex's compact Micro-One wire-to-board connector with integrated ISL ensures proper terminal insertion and prevents accidental back-outs.

EPCOS' B82472D6* series coupled inductors are compact, robust components and are suitable in a wide range of applications.

Sensata - Cynergy3's FLPV series float switches are ATEX and PED certified and are suitable for many aggressive liquids or hygienic applications.

Ledex STA series tubular actuator is well-suited for applications such as lock/latch, door interlocks, computer peripherals, and more.

Phoenix Contact's SPE connectors are ideal when a small connection profile is needed or to easily integrate devices and simplify circuit layouts.

Klein Tools' CAT6A Pass-Thru™ modular plugs offer fast and reliable connector installations for data applications.

Festo’s kink-resistant PUN-H tubing is easy to install and resistant to hydrolysis and microbes, making it perfect for use in the food industry.

Microchip Technology's PAC195X devices are energy monitors, with bus voltage monitors and current sense amplifiers that feed high-resolution ADCs.

ATP’s e.MMC BGA storage solutions have a wide temperature range, ensuring severe scenarios will not have an adverse impact on the device or the data within.