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Image of IXYS' 300 V Ultra-Junction X3-Class Power MOSFETs
300 V Ultra-Junction X3-Class HiPerFET™ Power MOSFETs

IXYS introduces their power semiconductor product line: 300 V ultra-junction X3-class HiPerFET™ power MOSFETs.

Image of Taica's Gel Bushings
Alpha-GEL® Bushings

Taica Corporation is the manufacturer of Alpha-GEL® silicone anti-vibration and impact-absorbing products, and Lambda-GEL® Thermal Interface Materials (TIMs).

Image of Davies Molding Expanded Metric Sizes for Popular Knob Styles
Expanded Metric Sizes for Popular Knob Styles

Davies Molding has expanded their knob offering with metric sizes of their popular knob styles.

Image of TE Connectivity's EN45545 Heavy Duty Connector (HDC) Inserts
EN45545 Heavy Duty Connector (HDC) Inserts

TE Connectivity's heavy duty connectors deliver outstanding performance in harsh environments across a wide range of applications.

Image of NXP i.MX 6ULZ Processor
i.MX 6ULZ Applications Processor

NXP's i.MX 6ULZ is a high-performance, cost-efficient consumer Linux processor featuring a single Arm® Cortex®-A7 core operating at 900 MHz.

Image of MEAN WELL's DRP-3200 and DPU-3200 Series Power Supplies
DRP-3200/DPU-3200 Series Power Supplies

MEAN WELL's DRP-3200 and DPU-3200 series fully digital intelligent AC-DC power supplies offer models with the DC output highly demanded by the industry.

Image of Nordic's nRF9160 SiP
nRF9160 System-In-Package (SiP)

Nordic's nRF9160 SiP offers a wide selection of general interfaces and peripherals for compact, complete, and energy-efficient cellular IoT solutions.

Image of Parker Chomerics' CHO-TOUCH™ Displays
CHO-TOUCH™ Displays

Parker Chomerics' CHO-TOUCH displays are optically bonded touchscreens and LCD units designed to save assembly time and supply chain logistics.

Image of WIMA's SMD-PEN Film Capacitors
SMD-PEN Film Capacitors

WIMA SMD series is produced with the proven box technology and covers almost the entire application range of conventional through-hole plastic film capacitors.

Image of Parker Chomerics' THERMFLOW® T777 Phase Change Material
THERMFLOW® T777 Phase Change Material

Parker Chomerics' THERMFLOW T777 phase change material designed to completely fill interfacial air gaps and voids within electronics assemblies.

Image of Parker Chomerics' CHO-SEAL 1285 Elastomer EMI Gasket
CHO-SEAL 1285 Elastomer EMI Gasket

Parker Chomerics’ CHO-SEAL 1285 elastomer EMI gasket is available in sheet form and extruded into various profiles for design and manufacturing flexibility.

Image of Parker Chomerics' CHO-SEAL 6502 Elastomer EMI Gasket
CHO-SEAL 6502 Elastomer EMI Gasket

Parker Chomerics CHO-SEAL 6502 EMI shielding gasket comes in sheet form and is extruded into various profiles allowing for design and manufacturing flexibility.

Image of Lattice's Himax HM01B0 UPduino Shield and SensAL Modular Demo Board
Himax HM01B0 UPduino Shield and sensAI Modular Demo Board

Lattice's Himax HM01B0 feature a convolutional neural network (CNN) using the compact CNN accelerator soft IP used in human presence and hand gesture detection.

5G Communications Connectivity
5G Communications Connectivity

5G is here. Increased speed, capacity, and bandwidth. TE Connectivity has powerful solutions to 5G communications connectivity design obstacles.

Image of Seoul Semiconductors's Y22 Series LEDs
Y22 Series LEDs

Seoul Semiconductor's WICOP series is designed for high flux output applications with high current operation capability.