Gap Pad® TGP 7000ULM

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Product Highlights > Gap Pad® TGP 7000ULM

            Gap Pad® TGP 7000ULM
                    Bergquist’s ultra-low modulus gap-filling material offers exceptional thermal performance at low pressures
    

Image of Bergquist's Gap Pad® TGP 7000ULM Bergquist’s Gap Pad TGP 7000ULM is an extremely soft gap-filling material rated at a thermal conductivity of 7.0 W/m-K that is specially formulated for high-performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra-low modulus resin formulation.

Gap Pad TGP 7000ULM is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.

Features

Low assembly stress due to ultra-low modulus (Shore 000 and ASTM D2240)
Excellent conformability to rough or irregular surfaces
Thorough wet out at the interface for maximized thermal transfer

High thermal conductivity of 7.0 W/m-K
Simplified application and processability; supplied in pre-cut, custom-sized pads with high tack on both sides
Room-temperature storage

Applications

Telecommunications
- Routers
- Switches
- Base stations

Optical transceivers
ASICs
DSPs