Kester Solder

NP510-LT HRL1 Solder Paste

Kester's lead-free, no-clean, high reliability low-temperature application paste

Image of Kester's NP510-LT HRL1 Solder PasteKester's NP510-LT HRL1 is a no-clean, lead-free, zero-halogen solder paste for assemblies that have temperature-sensitive substrates and components. The need for the reduction of warpage-induced defects is becoming more evident as product designs become more complex and packages become thinner. NP510-LT HRL1 addresses these technology needs by enabling lower temperatures to reflow and enhancing mechanical reliability. All components used with NP510-LT HRL1 must be lead-free to eliminate the formation of tin/lead/bismuth intermetallic, which has a melting point under +100°C.

Features
  • Classified ROL0 per IPC J-STD-004B
  • Zero-halogen (none intentionally added)
  • Lower reflow peak temperature (+180°C to +190°C) compared to traditional lead-free alloys
  • Reduction in board-to-package warpage
  • Wide reflow profile window with good solderability on various PCB surface finish
  • Excellent printability above 0.60 area ratio
  • Colorless residues for easy post-reflow inspection
  • Low voiding in various packages - BGA, MLG, DPAK, LGA
Applications
  • Low temperature
  • High-reliability low temperature
  • Lower peak reflow temperature
Published: 2021-04-15