MULTI-BEAM Card Edge Connectors

TE Connectivity’s MULTI-BEAM power card edge connectors are the next generation card edge products over SEC-II and deliver superior current and signal density for data communications and industrial applications.

MULTI-BEAM card edge connectors deliver the leading overall power and signal density to address data communication market requirements for performance, profile, and cost. This next generation power card edge connector offers 30% density improvement compared to legacy products and better connectivity tolerance for more reliable connections. The exclusive TE design is modular and scalable to support greater flexibility in configuration and printed circuit board design.

Benefits

• Provide greater power per contact up to 43 A
• Support two PCB thicknesses: 1.57 mm and 2.36 mm
• Achieve higher density with a 1.00 mm signal contact pitch (up to 60% space savings) and 7.26 mm power contact pitch (up to 30% space savings)
• Help prevent solder bridging with more clearance between PCB pads and the signal contact
• Provide easier mating alignment with 1.3 mm larger pads
• Offer improved gatherability for blind-mate applications [±2.0 mm (X), ±1.54 mm (Y)]
• Enhance scalability and modularity with common power and signal contact modules, different contact quantities and positions, and AC/DC, low power and high power
• Enable easy mating/un-mating with proper retention force and low level contact resistance
• Available in vertical, right angle, and straddle configurations