omniKlip-Series Heat Sinks and Clips

The Wakefield Thermal omniKlip heat sink series is a configurable and patented (pat. pending), high-performance, low-cost and compact solution for TO-220, TO-247, and TO-264 or similar packages. This powerful heat sink provides tool- and fixture-free assembly operation, large heatsink surface areas, and small-space occupation. It is the ideal type of heat sink for high power density and small size (1U or 2U) electronic packaging with forced convection cooling. Due to its design, it is also easily scalable to cover more TO-style packages.

Features

• Minimum assembly cost and labor: Spring clips make the mounting holes, fasteners, tools, and fixtures obsolete in assembly operations and also reduce costs.
• Maximum repeatability: They offer constant spring force over repeated assembly/disassembly.
• Maximum Reliability: Resilient spring action locks electronic component in place. They make for fewer parts in assembly with no fasteners and washers required. They prevent short circuits by eliminating metal particles generated from hardware or thread tapping.
• Design flexibility: They offer maximum flexibility for dynamic device locations and power upgrading. “Configure-to-fit” gives designers total freedom to configure the heat sink needed to fit their dynamic design environments.

Specifications

• Heat Sink: Aluminum alloy 6063-T5 or equivalent with black anodized finish
• Spring Clip: Music wire, per ASTM A228, with bright nickel plating
• Solder Foot: Cold-rolled steel, per ASTM A-366, with pure tin over copper strike and is RoHS compliant